U.S. Congress legislation · 119th Congress
HB6207: Chip EQUIP Act
Status: In committee, September 16, 2026
To prohibit purchases of certain semiconductor manufacturing equipment from foreign entities of concern or subsidiaries of foreign entities of concern, and for other purposes.
What the bill says
To prohibit purchases of certain semiconductor manufacturing equipment from foreign entities of concern or subsidiaries of foreign entities of concern, and for other purposes.
From the introduced text, November 20, 2025:
A BILL To prohibit purchases of certain semiconductor manufacturing equipment from foreign entities of concern or subsidiaries of foreign entities of concern, and for other purposes. SECTION 1. Short title This Act may be cited as the Chip Equipment Quality, Usefulness, and Integrity Protection Act of 2025 or the Chip EQUIP Act . SECTION 2. Purchases of semiconductor manufacturing equipment (a) Definitions Section 9901 of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 ( 15 U.S.C. 4651 ) is amended by adding at the end the and (B) ready to be purchased directly from an entity. (15) The term ineligible semiconductor manufacturing equipment -- (A) means completed, fully assembled equipment that is manufactured, assembled, or refurbished by a foreign entity of concern or subsidiary thereof and designed for use in the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors; (B) includes-- (i) deposition equipment; (ii) etching equipment; (iii) lithography equipment; (iv) inspection, measuring, and test equipment; (v) wafer slicing equipment; (vi) wafer dicing equipment; (vii) wire bonders; (viii) ion implantation equipment; (ix) chemical mechanical polishing; (x) diffusion or oxidation furnaces; (xi) thermal processing equipment; and (xii) automated material handling systems; and (C) does not include any part, chamber, subsystem, or subcomponent that enables or is incorporated into such equipment. . (b) …
Sponsors
- Zoe Lofgren (D) · primary sponsor
- Jay Obernolte (R, HD-CA-23)
- Raja Krishnamoorthi (D, HD-008)
- John Moolenaar (R, HD-002)
- Greg Landsman (D, HD-001)
- Erin Houchin (R, HD-009)
- Randy Weber (R, HD-014)
- Scott Peters (D, HD-CA-50)
- Brian Fitzpatrick (R, HD-001)
- Fedorchak, Julie (R, HD-000)
- Ryan Zinke (R, HD-001)
- Gabe Evans (R, HD-CO-8)
Latest actions
- : Ordered to be Reported by the Yeas and Nays: 39 - 0.
- : Committee Consideration and Mark-up Session Held
- : Forwarded by Subcommittee to Full Committee (Amended) by Voice Vote.
- : Subcommittee Consideration and Mark-up Session Held
- : Referred to the Subcommittee on Commerce, Manufacturing, and Trade.
- : Referred to the Committee on Energy and Commerce, and in addition to the Committee on Science, Space, and Technology, for a period to be subsequently determined by the Speaker, in each case for consideration of such provisions as fall within the jurisdiction of the committee concerned.
- : Introduced in House
Subjects: Russia, Foreign Trade and International Finance, Computers and information technology, Europe, Manufacturing, Iran, Middle East, Advanced technology and technological innovations
Common questions
- What is HB6207?
- HB6207 is a bill in Congress (119th Congress): Chip EQUIP Act.
- What does HB6207 do?
- In its own words: To prohibit purchases of certain semiconductor manufacturing equipment from foreign entities of concern or subsidiaries of foreign entities of concern, and for other purposes.
- What is the status of HB6207?
- In committee as of September 16, 2026. Latest action: Ordered to be Reported by the Yeas and Nays: 39 - 0. (September 16, 2026).
- Who sponsored HB6207?
- Zoe Lofgren (D), with 11 co-sponsors.
- Where is the official record for HB6207?
- On the Congress website: https://www.congress.gov/bill/119th-congress/house-bill/6207
Source: official Congress record. Tracked by Delilah, AI for legislation across all 50 states and Congress.